TSMC will starting full EUV lithography of 5 nanometer chips April 2019 | NextBigFuture.com

TSMC (Taiwan Semiconductor) taped out its first chip in a process making limited use of extreme ultraviolet lithography and will start risk production in April on a 5-nm node with full EUV. The foundry’s update showed that area and power gains continue in its leading-edge nodes, but chip speeds are no longer advancing at their historic rate. To compensate, TSMC gave an update on a half-dozen packaging techniques that it is developing to speed connections between chips. The TSMC N7+ node that can use EUV on up to four layers. Its N5 that will use EUV on up to 14